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Recent Packaging Systems News:
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Fujikura Ltd. announced its partnership with FlipChip International LLC (FCI) on next-generation semiconductor packaging technology . FCI and Fujikura have agreed to collaborate on the development and commercialization of next-generation semiconductor packaging including flexible substrate based embedded die , Fan-Out packages, and high density 3D interposer technologies.
IRVINE, Calif. -- Microsemi Corporation , a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a 9Gb DDR3 SDRAM memory device that is the first of its kind to be packaged in a single plastic ball grid array and offered as a compact x72 dual in-line memory module .
Mystic Pharmaceuticals, Inc. announces today that it has been granted U.S. Patent No. 7,963,089, “Deep Draw Container Forming Method,” for a key manufacturing technology of its VersiDoser™ and VRx2™ drug and biologic delivery systems.
BETHLEHEM, PA--(Marketwire - 06/08/11) - TJ Green Associates, LLC ( www.tjgreenllc.com ) today announced its 2011 public training course schedule on Material and Process Certification for Hybrids: Microwave Packaging Technology -- July 26-28, 2011 (3 days) Register now . Process Certification and Defect Recognition: Hybrids, Microcircuits, and RF/MMIC Modules ...
B&C Group is a Clinical Expert that provides world-class packaging and logistics services through Innovative technology and continuous improvement in Quality standards.
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Additional Packaging Systems Resources:
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1.
Siscodata Computer Srl
Italy. Design and manufacture of factory automation systems for the textile, mechanical, packaging and food product industries. Machinery and equipment for production control, inspection, folding and
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Automated Packaging Systems
Manufacturer provides autobaggers, packaging systems, imprinters, industrial poly bags and form fill seal systems.
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