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Recent Questions and Answers
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Recent Packaging Technology News:
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Mystic Pharmaceuticals, Inc. announces today that it has been granted U.S. Patent No. 7,963,089, “Deep Draw Container Forming Method,” for a key manufacturing technology of its VersiDoser™ and VRx2™ drug and biologic delivery systems.
B&C Group is a Clinical Expert that provides world-class packaging and logistics services through Innovative technology and continuous improvement in Quality standards.
Fujikura Ltd. announced its partnership with FlipChip International LLC (FCI) on next-generation semiconductor packaging technology . FCI and Fujikura have agreed to collaborate on the development and commercialization of next-generation semiconductor packaging including flexible substrate based embedded die , Fan-Out packages, and high density 3D interposer technologies.
BETHLEHEM, PA--(Marketwire - 06/08/11) - TJ Green Associates, LLC ( www.tjgreenllc.com ) today announced its 2011 public training course schedule on Material and Process Certification for Hybrids: Microwave Packaging Technology -- July 26-28, 2011 (3 days) Register now . Process Certification and Defect Recognition: Hybrids, Microcircuits, and RF/MMIC Modules ...
IRVINE, Calif. -- Microsemi Corporation , a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a 9Gb DDR3 SDRAM memory device that is the first of its kind to be packaged in a single plastic ball grid array and offered as a compact x72 dual in-line memory module .
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Additional Packaging Technology Resources:
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Packaging Technology
The World Packaging Organisation's official packaging products and service suppliers catalogue.
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Packaging Gateway - WPO
Who's who at the WPO plus the official packaging statutes. Contact regional packaging federations and WPO members. Worldstar Packaging Awards · Events
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Packaging Technology and Science
Packaging Technology and Science. Enter words or phrases. Select a Field. All Fields, Article Titles, Author, Full Text / Abstracts, Author Affiliation
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1.
Multifeeder Technology
Designs and manufactures high-performance, high-speed friction feeding equipment and accessories for use in the packaging, printing and mailing industries.
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Nano Packaging Technology, Inc.
TO-headers and butterfly packages for opto-electronic components. Brazing, glass-to-metal hermetic sealing, electroless, electrolytic silver and gold plating.
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